| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1529437 | Materials Science and Engineering: B | 2012 | 5 Pages |
Abstract
⺠Pd doping has significant effect on the microstructural development of Sn3.0Ag0.5Cu solder. ⺠The growth of intermetallics reduced by adding Pd. ⺠Pd mainly dissolved in Cu6Sn5. ⺠Adding Pd into the solder improves stability of the intermetallics.
Related Topics
Physical Sciences and Engineering
Materials Science
Electronic, Optical and Magnetic Materials
Authors
I-Tai Wang, Jenq-Gong Duh, Chih-Yuan Cheng, Jim Wang,