Self-organized nanostructures in silicon and glass for MEMS, MOEMS and BioMEMS

The utilization of self-organization in the process workflows for Micro-Electro-Mechanical-Systems (MEMS) and their derivatives is a smart way to get large areas of nanostructured surfaces for various applications. The generation of nano-masking spots by self-organizing residues in the plasma can lead to needle- or tube-like structures on the surface after (deep-) reactive ion etching. With lengths of 3 up to 25 μm and 150 up to 500 nm in diameter for silicon broad applications in the fields of micro fluidics with catalysts, micro-optical or mechanical mountings or carrier wafer bonding in microelectronics are possible. Now, we also developed dry etching processes for fused silica which shows analogue properties to ‘Black Silicon’ and investigated these glass nanostructures by a first parameter study to identify new usable structures and hybrids. This innovative starting point allows the transfer of ‘Black Silicon’ technologies and its applications to another important material class in micro- and nanotechnologies, fused silica.