Article ID Journal Published Year Pages File Type
1531661 Materials Science and Engineering: B 2006 5 Pages PDF
Abstract

Uniaxial process induced stress is being adopted in all 90, 65, and 45 nm high performance logic technologies. The uniaxial stress offers large performance improvement at low cost and minimally increased manufacturing complexity and is scalable to future technology nodes. The mobility enhancement is larger for uniaxial than biaxial stress and can be understood from the strain altered band structure.

Related Topics
Physical Sciences and Engineering Materials Science Electronic, Optical and Magnetic Materials
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