Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1531661 | Materials Science and Engineering: B | 2006 | 5 Pages |
Abstract
Uniaxial process induced stress is being adopted in all 90, 65, and 45 nm high performance logic technologies. The uniaxial stress offers large performance improvement at low cost and minimally increased manufacturing complexity and is scalable to future technology nodes. The mobility enhancement is larger for uniaxial than biaxial stress and can be understood from the strain altered band structure.
Related Topics
Physical Sciences and Engineering
Materials Science
Electronic, Optical and Magnetic Materials
Authors
Y. Sun, G. Sun, S. Parthasarathy, S.E. Thompson,