| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1532085 | Materials Science and Engineering: B | 2006 | 8 Pages |
Abstract
Microcrack nucleation and propagation behavior in pure tin solder was investigated by using transmission electron microscopy (TEM) through in situ tensile test. Observation results showed that fracture process was completed in this visco-plastic material by connecting discontinuous cracks or voids. Depending on remarkable vacancy diffusion ability, microvoids were nucleated and developed in the dislocation free zone (DFZ) or super thinned area ahead of crack tip under local high stress concentration. The cracks were linked with each other by mutual dislocation emission which expedites the propagation of crack tips effectively.
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Authors
Ying Ding, Chunqing Wang, Mingyu Li, Weiqiang Wang,