Effects of temperature and stress on the creep behavior of a Ni3Al base single crystal alloy

The creep behavior and microstructure of a Ni3Al base single crystal alloy IC6SX with [001] orientation under the testing conditions of 760 °C/593 MPa, 980 °C/205 MPa, and 1100 °C/75 MPa were investigated. The experimental results showed that Alloy IC6SX had good creep resistance and its creep resistance at elevated temperatures was similar to the second generation nickel-base single crystal alloy containing Re. TEM analysis indicated that the dislocation configuration and movement pattern were different under different temperature and stress conditions. It has been found that under the test condition of 1070 °C/137 MPa the dislocations moved within the γ channel during the primary creep stage, and the motion of dislocations were prevented by the matrix of γ′ phase, which reduced the creep rate of the alloy. In the secondary creep stage, dislocations cut into the γ′ phase from the γ/γ′ interface. However in the third creep stage, the dislocation pileups were observed in both γ and γ′ phase, and dislocation multiplication occurred when the dislocations with different Burgers vector met and reacted each other.