Article ID Journal Published Year Pages File Type
1556102 Journal of Materials Science & Technology 2013 5 Pages PDF
Abstract

The relationship between the vapor pressure of liquid copper and the flow rate of carrier gas argon was discussed, when the carrier gas method was used to determine the vapor pressure of liquid copper at 1892 K. The proper argon flow rate range obtained was 150–500 mL/min and enough evidence was provided to verify the vapor pressure-flow rate of carrier gas relationship at the target temperature. Based on the proper flow rate range, the vapor pressure of liquid copper was measured at 1609–1892 K. The relationship of vapor pressure–temperature obtained by the method of regression analysis can be expressed as: ln(p/Pa) = (25.470 ± 0.903) − (39099.8 ± 1574.5)/T. Further, the thermodynamic properties including the heat of vaporization and the Gibbs free energy of the Cu (l) = Cu (g) reaction were calculated by the vapor pressure obtained over the temperature range covered.

Related Topics
Physical Sciences and Engineering Materials Science Materials Chemistry
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