| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1556563 | Journal of Materials Science & Technology | 2014 | 4 Pages |
Abstract
Transient liquid phase (TLP) bonding of 304 stainless steel with nickel based filler metal, BNi-9, was performed to study the influence of silicon nanoparticles (NPs) on the mechanical and structural properties of the bonding area. It was found that silicon NPs act as a melting point depressant in the brazing process; the formation of silicon TLP induces the dissolution of elements of the metal filler and promotes a uniform distribution in the bonding area. Silicon NPs induce the development of smaller eutectic structures in the melting zone; it has been related to microhardness measurements, which are lower when the silicon NPs are used in the brazing process.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Chemistry
Authors
H.M. Hdz-GarcÃa, A.I. Martinez, R. Muñoz-Arroyo, J.L. Acevedo-Dávila, F. GarcÃa-Vázquez, F.A. Reyes-Valdes,