| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1557004 | Journal of Materials Science & Technology | 2012 | 6 Pages |
Abstract
Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interfacial metallurgical reaction, which can lead to pore closure phenomenon, as the liquid infiltration facilitating the wetting process.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Chemistry
Authors
Qingquan Lai, Lei Zhang, Cai Chen, J.K. Shang,