| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1560630 | Computational Materials Science | 2014 | 6 Pages |
Abstract
Highlights
- The Cu consumption mechanism is investigated by employing first principles.
- The effects of electric field and Sn grain orientation are considered.
- The Cu diffusion energies along a and c-axis of Sn grain are 0.83 and 0.17Â eV.
- The Cu diffusion energies decreased with the increase of electric field.
- The Cu consumption mechanism is investigated by employing first principles.
- The effects of electric field and Sn grain orientation are considered.
- The Cu diffusion energies along a and c-axis of Sn grain are 0.83 and 0.17Â eV.
- The Cu diffusion energies decreased with the increase of electric field.
Keywords
Related Topics
Physical Sciences and Engineering
Engineering
Computational Mechanics
Authors
Jie-Shi Chen, Meng-Jia Xu, Yu-Jing Jin, Kai-Yun Wang, Yu Chun, Hao Lu,