| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1561188 | Computational Materials Science | 2013 | 13 Pages |
Abstract
⺠Vacancy, stress and damage evolution of solder joints under PDC is investigated. ⺠An electromigration and thermomigration damage model is proposed. ⺠Frequency, duty cycle and current density dependence of damage is investigated. ⺠SEM images show that vacancy accumulates only at skin layer of solders. ⺠A mean time to failure equation is proposed for solder joints under PDC loadings.
Keywords
Related Topics
Physical Sciences and Engineering
Engineering
Computational Mechanics
Authors
Wei Yao, Cemal Basaran,