Dislocation density and flow stress modeling of nanostructured Al–SiCp composite during accumulative roll bonding

In order to investigate the dislocation structure and flow stress evolution of Al–SiCp composite during ARB process, a comprehensive model which describes the evolution of dislocation density is needed. Dislocation density, microstructure and flow stress evolution of Al–SiCp composite are predicted considering the ETMB model, strain and strain rate achieved from the mechanical model of ARB process and shear modulus calculated from the composite model. In addition, models’ parameters such as dislocation generation parameters are modified due to the effect of SiC particles. The predicted results are in good agreement with experimental data.

► Dislocation density and composite models are utilized for ARB of Al–SiCp composite. ► Cell size and strength of Al–SiCp composite during ARB are predicted. ► The model predictions are in good agreement with the experimental data.