| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1561382 | Computational Materials Science | 2013 | 15 Pages |
Abstract
⺠Computational homogenization analysis of conductive adhesive interconnect. ⺠Effects of varying particle fraction and distribution on residual stresses. ⺠High particle fraction decreases overall stress but increases fine scale stress. ⺠Percolated particle arrangement leads to high fine scale stress concentrations. ⺠Multiscale approach is crucial for the analysis of this problem.
Related Topics
Physical Sciences and Engineering
Engineering
Computational Mechanics
Authors
M. Erinc, M. van Dijk, V.G. Kouznetsova,