| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1561657 | Computational Materials Science | 2012 | 15 Pages |
Abstract
⺠Damage mechanism of realistic Flip Chip Solder joints (FCSJs) is investigated. ⺠FCSJs high-temperature reliability is modelled using Anand's visco-plasticity. ⺠Very thin and very thick thicknesses of IMC impact FCSJ reliability. ⺠Solder strain controlled studies with strain range lower than 0.12 is inadequate to simulate FCSJ's damage. ⺠Accumulated FCSJ damage is dependent on percentage of IMC and solder in joint.
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Related Topics
Physical Sciences and Engineering
Engineering
Computational Mechanics
Authors
Emeka H. Amalu, N.N. Ekere,