| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1562397 | Computational Materials Science | 2011 | 12 Pages |
Abstract
⺠A new 2-D numerical simulation model was developed to study kinetics of TLP bonding process. ⺠The model outputs were found to be in good conformity with experimental results. ⺠Diffusivity along intergranular regions did not significantly reduce processing time. ⺠Increased processing time in single crystal superalloy was not due to absence of grain boundaries.
Keywords
Related Topics
Physical Sciences and Engineering
Engineering
Computational Mechanics
Authors
A. Ghoneim, O.A. Ojo,