| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1562401 | Computational Materials Science | 2011 | 12 Pages |
Abstract
⺠X-FEM is used to simulate crack growth in solder joints for the first time. ⺠This is the first attempt to generate random grain structures in order to model the recrystallized microstructure of thermally cycled solder joints. ⺠Using the meshing procedure proposed in the article, crack growth calculations in solder joints can be automated completely. ⺠The statistical variety of possible grain structures in solder joints may therefore be captured by performing many crack growth calculations for different grain structures in parallel. As a result a realistic failure probability for solder joints can be obtained in industrial applications. ⺠Constitutive laws for the grains are determined in an inverse procedure. ⺠Crack growth simulations are compared to experimental data taken from the literature.
Related Topics
Physical Sciences and Engineering
Engineering
Computational Mechanics
Authors
Alexander Menk, Stéphane P.A. Bordas,