| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1562891 | Computational Materials Science | 2009 | 8 Pages |
Abstract
A Monte Carlo simulation based algorithm is developed to compute the effective diffusivity of lead free solder alloys. Simulations are performed to determine the vacancy diffusivity for 95.5Sn–4.0Ag–0.5Cu (SAC405) solder alloy for different paths. Temperature and micro-structural influence on diffusivity are studied. A map of diffusivity versus temperature and average grain size is developed. Significant differences between diffusivity values reported in the literature for the same solder alloy is also discussed.
Related Topics
Physical Sciences and Engineering
Engineering
Computational Mechanics
Authors
Shidong Li, Cemal Basaran,