Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1562925 | Computational Materials Science | 2009 | 5 Pages |
Using a mechanical model and dislocation density based model, the evolutions of dislocation density and flow stress of pure copper during constrained groove pressing (CGP) process are investigated. In this regard, the strain and strain rate are achieved from the mechanical model and then input into the dislocation model. To verify the predicted flow stress, the process of constrained groove pressing is performed on the sheets of pure copper from one to three passes. The predicted flow stresses are compared with the experimental data and a good agreement is observed. Also, it is found that during the straining of the copper sheet in CGP process, the dislocation density and strength dropping occur in lower strain than that in other severe plastic deformation processes.