| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1563150 | Computational Materials Science | 2009 | 5 Pages |
In this study, the distribution of the thermal residual stresses due to the adhesive curing in bonded composite repair is analysed using the finite element method. The computation of these stresses comprises all components of the structures: cracked plate, composite patch and adhesive layer. In addition, the influence of these residual stresses on the repair performance is highlighted by analysing their effect on the stress intensity factor at the crack tip. The obtained results show that the normal thermal stresses in the plate and the patch are important and the shear stresses are less significant. The level of the adhesive thermal stresses is relatively high. The presence of the thermal stresses increases the stress intensity factor at the crack tip, what reduce the repair performance.
