| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1570825 | Materials Characterization | 2015 | 7 Pages |
Abstract
Au/Cu bilayers with different Au:Cu concentrations (25:75, 50:50 and 75:25Â at.%) were deposited on Si(100) substrates by thermal evaporation. The thicknesses of all Au/Cu bilayers were 150Â nm. The alloys were prepared by thermal diffusion into a vacuum oven with argon atmosphere at 690Â K during 1Â h. X-ray diffraction analysis revealed different phases of AuCu and CuSi alloys in the samples after annealing process. CuSi alloys were mainly obtained for 25:75Â at.% samples, meanwhile the AuCuII phase dominates for samples prepared with 50:50Â at.%. Additionally, the Au:Cu alloys with 75:25Â at.%, produce Au2Cu3 and Au3Cu phases. The formed alloys were characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM), transmission electron microscopy (TEM) and energy dispersive spectroscopy (EDS) to study the morphology and the elemental concentration of the formed alloys.
Keywords
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Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
T.E. Novelo, P. Amézaga-Madrid, R.D. Maldonado, A.I. Oliva, G.M. Alonzo-Medina,