Article ID Journal Published Year Pages File Type
1570948 Materials Characterization 2014 10 Pages PDF
Abstract

Transmission electron microscopy (TEM) examinations on as-received, cold worked, as well as cold worked and creep tested phosphorus-alloyed oxygen-free copper (Cu-OFP) have been carried out to study the role of the cell structure. The cell size decreased linearly with increasing plastic deformation in tension. The flow stress in the tests could also be correlated to the cell size. The observed relation between the flow stress and the cell size was in excellent agreement with previously published results. The dense dislocation walls that appeared after cold work in tension is likely to be the main reason for the dramatic increase in creep strength. The dense dislocation walls act as barriers against dislocation motion and their presence also reduces the recovery rate due to an unbalanced dislocation content.

Related Topics
Physical Sciences and Engineering Materials Science Materials Science (General)
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