| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1571609 | Materials Characterization | 2011 | 9 Pages |
Abstract
⺠DD98 and K465 alloy was TLP bonded. ⺠The microstructure changes of different parts were studied. ⺠CrB, M23B6 and MC formed in the bonding zone. ⺠M6C appeared in diffusion zone of K465 side and M3B2 existed in diffusion zone of DD98 side.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Ji-de Liu, Tao Jin, Nai-ren Zhao, Zhi-hui Wang, Xiao-feng Sun, Heng-rong Guan, Zhuang-qi Hu,