| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1571631 | Materials Characterization | 2012 | 9 Pages |
Abstract
⺠Mo nanoparticles do not dissolve or react with the SAC solder during reflow. ⺠Addition of Mo nanoparticles results smaller IMC thickness and scallop diameter. ⺠Mo nanoparticles influence the interfacial IMC through discrete particle effect.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
A.S.M.A. Haseeb, M.M. Arafat, Mohd Rafie Johan,