Microstructural developments in TLP bonds using thin interlayers based on Ni-B coatings

Oxide dispersion strengthened alloy MA 758 was transient liquid phase (TLP) bonded using thin interlayers based on Ni-B electrodeposited coatings and the microstructural developments across the joint region were studied. The bonding surfaces were electrodeposited with a coat thickness of 2-9 μm and microstructural features were characterized by scanning electron microscopy and energy dispersive X-ray spectroscopy. The homogeneity of the joint was assessed performing micro-hardness test. The results showed that the coating thickness as well as the amount of melting point depressants (boron) in the coatings had a significant effect on the microstructural developments within the joint region. TLP bonds made using a 2 μm thick coating interlayer produced a joint with no visible precipitate formation and parent metal dissolution, and the absence of precipitates was attributed to the lower volume concentration of boron in the 2 μm thick coating interlayer.