| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1572402 | Materials Characterization | 2010 | 4 Pages |
Abstract
High purity copper (99.99%) was severely plastically deformed by miniaturized extrusion preceded ECAP at 200 °C. A partially recrystallized microstructure was detected by TEM observations due to the relative high processing temperature. Isochronal annealing was performed to investigate the material's behavior by measuring the development of Vickers microhardness. As copper is a metal with a relative low stacking fault energy, recovery does not occur readily and only recrystallization takes place.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Aikaterini Zi,