| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1572465 | Materials Characterization | 2008 | 6 Pages |
Abstract
Nano-scale interfacial details of ultrasonic AlSi1 wire wedge bonding to a Au/Ni/Cu pad were investigated using high resolution transmission electron microscopy (HRTEM). The intermetallic phase Au8Al3 formed locally due to diffusion and reaction activated by ultrasound at the Al/Au bond interface. Multilayer sub-interfaces roughly parallel to the wire/pad interface were observed among this phase, and interdiffusional features near the Au pad resembled interference patterns, alternately dark and bright bars. Solid-state diffusion theory cannot be used to explain why such a thick compound formed within milliseconds at room temperature. The major formation of metallurgical bonds was attributed to ultrasonic cyclic vibration.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Hongjun Ji, Mingyu Li, Jong-Myung Kim, Dae-Won Kim, Chunqing Wang,