| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1572855 | Materials Characterization | 2008 | 8 Pages |
The effect of process variables on the microstructure of transient liquid phase bonded IN 600 using a commercial filler alloy was studied. Microstructural examination of bonded specimens showed that isothermal solidification of the liquated insert occurred during holding at the joining temperatures. In cases where the holding time was insufficient for complete isothermal solidification, the residual liquid transformed on cooling into a centerline eutectic product. The width of the eutectic decreased with increased holding time and an increase in initial gap width resulted in thicker eutectic width in specimens bonded at the same temperature and for equivalent holding times. In addition to the centerline eutectic microconstituent, precipitation of boron-rich particles was observed within the base metal region adjacent to the substrate–joint interface. Formation of these particles appeared to have influenced the rate of solidification of the liquated interlayer during bonding. In contrast to the conventional expectation of an increase in the rate of isothermal solidification with an increase in temperature, a decrease in the rate was observed with an increase in temperatures above 1160 °C. This could be related to a decrease in solubility of boron in nickel above the Ni–B eutectic temperature.
