| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1573238 | Materials Science and Engineering: A | 2016 | 4 Pages |
Abstract
Hu et al. [1] reported the strains measured during unloading of nanocrystalline Cu in the course of deformation at room temperature. The inelastic strain rates during unloading are found to be larger than the quasi-stationary rates. This remarkable result is interpreted in terms of recovery strain acting as a second deformation mechanism in addition to the primary mechanism of glide of free dislocations.
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Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Wolfgang Blum, Philip Eisenlohr, Jiangjiang Hu,