Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1573382 | Materials Science and Engineering: A | 2016 | 8 Pages |
Abstract
Silver pastes sintering is a potential candidate for die bonding in power electronic modules. The joints, obtained by sintering, exhibit a significant pore fraction thus reducing the density of the material compared to bulk silver. This was shown to alter drastically the mechanical properties (Young's modulus, yield strength and ultimate tensile stress) at room temperature. While careful analysis of the microstructure has been reported for the as-sintered material, little is known about its quantitative evolution (pores and grains) during thermal ageing. To address this issue, sintered bulk specimens and sintered joints were aged either under isothermal conditions (125 °C up to 1500 h) or under thermal cycling (between â40 °C/+125 °C with 30 min dwell time at each temperature for 2400 cycles). Under these conditions, it is shown that the density of the material does not change but the sub-micron porosity evolves towards a broader size distribution, consistent with Oswald ripening. It is also shown that only the step at 125 °C during the non-isothermal ageing is responsible for the microstructure evolution: isothermal ageing at high temperature can be regarded as a useful tool to perform accelerated ageing tests. Tensile properties are investigated as both a function of ageing time and a function of density. It is shown that the elastic properties do not evolve with the ageing time unlike the plastic properties. This is discussed as a function of the material microstructure evolution.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Pascal Gadaud, Vincenzo Caccuri, Denis Bertheau, James Carr, Xavier Milhet,