| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1574553 | Materials Science and Engineering: A | 2015 | 4 Pages |
Abstract
We clearly show that fatigue-induced grain growth is suppressed in the annealed nanocrystalline Cu films, which leads to the enhanced resistance to fatigue cracking compared with that of the as-deposited ones. Annealing-stabilization of the nanograin boundaries may provide a potential way to enhance fatigue reliability of nanoscale film-based flexible devices.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
B. Zhang, T.Y. Xiao, X.M. Luo, X.F. Zhu, G.P. Zhang,