Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1574681 | Materials Science and Engineering: A | 2014 | 7 Pages |
Abstract
The microstructure analysis suggested that the hardness or tensile strength increased after an aging heat treatment due to the large number of nanometer-sized precipitates of β-Ni3Si and δ-Ni2Si phases that were formed. The optimal heat treated P/M copper alloy (8-h solution heat treatment at 970 °C followed by 6-h aging at 450 °C) had an extremely good combination of an average sub-grain size (<30 μm), an average tensile strength (up to 820 MPa) and an average thermal conductivity (110 W/mK), which offers possibilities for application in mold tooling.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Huei-Sen Wang, Hou-Guang Chen, Jhen-Wang Gu, Cheng-En Hsu, Chung-Yung Wu,