Article ID Journal Published Year Pages File Type
1574681 Materials Science and Engineering: A 2014 7 Pages PDF
Abstract
The microstructure analysis suggested that the hardness or tensile strength increased after an aging heat treatment due to the large number of nanometer-sized precipitates of β-Ni3Si and δ-Ni2Si phases that were formed. The optimal heat treated P/M copper alloy (8-h solution heat treatment at 970 °C followed by 6-h aging at 450 °C) had an extremely good combination of an average sub-grain size (<30 μm), an average tensile strength (up to 820 MPa) and an average thermal conductivity (110 W/mK), which offers possibilities for application in mold tooling.
Related Topics
Physical Sciences and Engineering Materials Science Materials Science (General)
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