Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1575807 | Materials Science and Engineering: A | 2013 | 5 Pages |
Abstract
Two-ply Al/Cu sheets were prepared via roll bonding with different reduction ratios. Al/Cu sheets fabricated below 50% of reduction ratio exhibited relatively equiaxed grains without interface reaction, which resulted in weak joint-bonding strength. However, both strong metallurgical bonding at interface and fine, elongated grains from constituent alloys adjacent to the interface were successfully introduced under the reduction ratio of 65%, leading to a strongly enhanced bonding strength of 17.1Â N/mm together with an increased elongation up to fracture by 28%.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
K.S. Lee, S.E. Lee, H.K. Sung, D.H. Lee, J.S. Kim, Y.W. Chang, S. Lee, Y.N. Kwon,