Article ID Journal Published Year Pages File Type
1575978 Materials Science and Engineering: A 2013 5 Pages PDF
Abstract
The Ti-(SiCp/Al) laminated composite was prepared by roll bonding of pure Ti and SiCp/Al foils. The microstructure analysis shows that the work-hardening of Ti reduces the deformation compatibility of the Ti and SiCp/Al layers with increasing the rolling reduction. A nano-sized TiAl3 interfacial layer was formed at the interface between the Ti and SiCp/Al layers, which resulted in a good interlaminar bonding strength and an improved ductility of the laminated composite due to the nano-sized effect. A good strength-ductility balance, 307 MPa yield strength and 21.4% elongation to failure, was achieved. Combining with the low density of 3.62 g/cm3, 20% lower than that of Ti, this Ti-(SiCp/Al) laminated composite presents the potential application in the aerospace field.
Related Topics
Physical Sciences and Engineering Materials Science Materials Science (General)
Authors
, , , , , , ,