Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1575978 | Materials Science and Engineering: A | 2013 | 5 Pages |
Abstract
The Ti-(SiCp/Al) laminated composite was prepared by roll bonding of pure Ti and SiCp/Al foils. The microstructure analysis shows that the work-hardening of Ti reduces the deformation compatibility of the Ti and SiCp/Al layers with increasing the rolling reduction. A nano-sized TiAl3 interfacial layer was formed at the interface between the Ti and SiCp/Al layers, which resulted in a good interlaminar bonding strength and an improved ductility of the laminated composite due to the nano-sized effect. A good strength-ductility balance, 307Â MPa yield strength and 21.4% elongation to failure, was achieved. Combining with the low density of 3.62Â g/cm3, 20% lower than that of Ti, this Ti-(SiCp/Al) laminated composite presents the potential application in the aerospace field.
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Authors
J.C. Pang, G.H. Fan, X.P. Cui, A.B. Li, L. Geng, Z.Z. Zheng, Q.W. Wang,