| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1576583 | Materials Science and Engineering: A | 2013 | 4 Pages |
Abstract
Slip mode modification of planar slip Cu-Al single crystals with low stacking fault energy was studied at various temperatures. The changes of surface slip appearance and dislocation substructure with temperature was observed and explained in terms of the roles of stacking fault energy and dynamic strain aging.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Jong Su Ha, Sun Ig Hong,