The thermal stability of nanocrystalline copper cryogenically milled with tungsten

Copper (Cu) was cryogenically milled with tungsten (W) in a high-energy ball mill. The process created W particles dispersed in a nanocrystalline Cu matrix. These “alloys” were then annealed to a maximum temperature of 800 °C. The addition of W stabilized the Cu at∼40 nm during annealing to 400 °C for a 1 at% W composition and to 600 °C for 10 at% W. As evidenced through hardness measurement, the W provided a significant increase in strength over pure Cu, and the 10 at% W material maintained a 2.6 GPa hardness after annealing at 800 °C. The stabilization and strengthening mechanisms are compared against theoretical prediction and found to be in good agreement. Although the strength and stability are significantly improved over pure Cu, the maximum benefit was hindered by an extremely broad W particle size distribution (∼5–5000 nm). For the 10 at% W alloy, only half of the added W was reduced to nanoscale where kinetic pinning and strengthening become most effective.