| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1576816 | Materials Science and Engineering: A | 2012 | 7 Pages |
Abstract
The effect of microstructure and corrosion on fracture behavior of Sn-3.0Ag-0.5Cu (SAC305) solder alloy was in-situ studied at three-point bending test using environmental scanning electron microscopy (ESEM). The results showed that the microcracks initiated at the Sn boundaries in the β-Sn region for commercial SAC305 solder. For furnace-cooled SAC305 solder, cracks preferred to initiating and propagating along Sn boundaries and Sn/Ag3Sn interface. Ag3Sn plates were easily broken during the bending test. The fracture behavior was significantly affected by corrosion. The most vulnerable area to fracture is the corroded region of the specimen.
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Authors
Mingna Wang, Jianqiu Wang, Hao Feng, Wei Ke,