Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1576844 | Materials Science and Engineering: A | 2012 | 14 Pages |
Abstract
Tensile creep behavior of Al-5SiCp composite, powder metallurgy processed and hot-rolled at either 400 °C (400-HRC) or 600 °C (600-HRC), has been examined. Creep-tests have been carried out at temperature and stress ranges of 325-400 °C and 9-21 MPa, respectively. The creep behavior has been examined by analyzing steady-state creep rate, time to rupture, Larson-Miller parameter (LMP), strain fractions in primary, secondary and tertiary stages, with assessment of damage and dimple size. The creep resistance of 400-HRC with higher dislocation density is found as greater than that of 600-HRC, whereas apparent stress exponents and activation energies exceed that for dislocation climb. The results suggest possibility of life prediction using Monkman-Grant relationship and LMP variation with stress. Thermal cycling between 500 °C and 0 °C is more effective in improving creep resistance at lower temperatures, and is more beneficial for 400-HRC than for 600-HRC, confirming positive role of strain-hardening.
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Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Jishnu J. Bhattacharyya, R. Mitra,