| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1577431 | Materials Science and Engineering: A | 2012 | 7 Pages |
Abstract
⺠Effect of TiO2 nanoparticles addition on the Sn0.7Cu solder alloys is discussed. ⺠Additions of TiO2 nanoparticles results the microstructure and mechanical property dramatically. ⺠Strengthening mechanism of SC composite solder.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
L.C. Tsao, C.H. Huang, C.H. Chung, R.S. Chen,