Article ID Journal Published Year Pages File Type
1577701 Materials Science and Engineering: A 2012 7 Pages PDF
Abstract
► Diffusion bonding behaviour of ECAPed Cu-Cr-Zr alloy and copper is investigated. ► Thermal stability of the materials is presented. ► Micostructural evolution of the two materials with ECAP is presented.
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Related Topics
Physical Sciences and Engineering Materials Science Materials Science (General)
Preview
Recrystallisation and bonding behaviour of ultra fine grained copper and Cu-Cr-Zr alloy using ECAP
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