Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1577701 | Materials Science and Engineering: A | 2012 | 7 Pages |
Abstract
⺠Diffusion bonding behaviour of ECAPed Cu-Cr-Zr alloy and copper is investigated. ⺠Thermal stability of the materials is presented. ⺠Micostructural evolution of the two materials with ECAP is presented.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
P.K. Jayakumar, K. Balasubramanian, G. Rabindranath Tagore,