| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1577856 | Materials Science and Engineering: A | 2012 | 9 Pages |
Abstract
⺠Tensile and dynamic properties of lead-free solder were evaluated. ⺠Emphasis on addition of bismuth to alloys and role of isothermal aging. ⺠Addition of bismuth increases strength. ⺠Strength maintained in Bi-containing alloy after aging, which is opposite of SAC305. ⺠Unlike SAC305 damping capacity of Bi-containing changes with aging like SnPb and Sn.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
David B. Witkin,