| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1578396 | Materials Science and Engineering: A | 2011 | 4 Pages |
Abstract
Heat treatments performed on copper-clad aluminium thin wires increase the ductility of copper and aluminium but activate diffusion between both layers, creating brittle intermetallic compounds. Ductility reaches a maximum for an optimal intermetallic thickness related to appropriate annealing conditions in order to avoid Kirkendall void formation assisted by stress gradients.
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Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
E. Hug, N. Bellido,