Shear banding deformation in Cu/Ta nano-multilayers

Nanoscale Cu/Ta multilayers with individual layer thickness ranging from 3 to 70 nm were deformed under nanoindentation at room temperature. Shear bands can be observed only when individual layer thickness is reduced to 9 nm or below, indicating formation of shear bands in the Cu/Ta multilayers is layer thickness dependent. By observing the cross sectional transmission electron microscope images of the indentation fabricated through focused ion beam technique, shear banding deformation causing a unique layer-morphology with prevalent mismatched laminate structure has been reported for the first time. By capturing and analyzing a series of typical indentation-induced deformed microstructures, a new physical mechanism of shear banding behavior in metallic nano-multilayers is suggested.

► Formation of shear bands in Cu/Ta multilayers is layer thickness dependent. ► Unique layer-morphology with prevalent mismatched laminate structure was observed. ► A new physical mechanism that dominates shear band formation is suggested.