| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1578438 | Materials Science and Engineering: A | 2011 | 7 Pages |
Abstract
⺠A low cost method of diffusion bonding has been developed for complex-shaped components of Ti6Al4V. ⺠Vacuum brazing has been used to seal the periphery to allow encapsulation-free HIPping. ⺠The tensile properties of the bonds are comparable with those of the bulk material, but the fatigue life was slightly reduced.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Z. Wu, J. Mei, W. Voice, Steve Beech, X. Wu,