| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1578705 | Materials Science and Engineering: A | 2011 | 9 Pages |
Abstract
⺠Creep behavior above solidus of an Al-alloy was investigated using a DMA. ⺠Measurement of creep modulus (âelastic) above solidus was done with good accuracy. ⺠The influence of grain morphology on the modulus with 8-9% liquid was revealed. ⺠With â¼8% liquid, failure or not depended that the applied stress was 0.5 or 1 MPa. ⺠Liquation of coalesced grain boundaries was revealed upon reheating.
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Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
D. Levasseur, D. Larouche,