| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1578837 | Materials Science and Engineering: A | 2010 | 8 Pages |
Abstract
ⶠAdhesion strength of flip chip interconnections using ACF is measured. ⶠAdhesion strength of Si/ACF is weaker than FR4/ACF. ⶠSi/ACF is the crucial region where delamination might occur during service. ⶠMoisture absorption can degrade the intrinsic adhesion property of ACF material.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Gi-Dong Sim, Chang-Kyu Chung, Kyung-Wook Paik, Soon-Bok Lee,