Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

In this work, tensile deformation of Sn–3.8Ag–0.7Cu (SAC387) solder and composite of SAC387 reinforced with nano-sized Mo particles have been studied with strain rates from 10−5 to 10−1 s−1 and temperatures of 25, 75 and 125 °C. It is found that the yield strength (σY.S) and strain hardening exponent (n) are increased with the strain rate, but the n values decrease with increasing temperatures. The n values of the composite solder are also increased with the percentage of the Mo nano-particles (up to 1 wt.%) and thereafter decrease with further increasing of the Mo particle. The strain rate dependence of the Hollomon parameters is found to be stronger at higher temperatures for SAC387 solder, but it is weaker for the composite solders. Empirical equations for σY.S and Hollomon parameters with strain rate and temperatures have been found for both SAC387 and composite solders. Finally, the fracture surfaces of the solders are examined.

Graphical abstractFigure optionsDownload full-size imageDownload as PowerPoint slideResearch highlights► Lead-free composite solder – SAC387 with nano-sized Mo particles. ► Tensile deformation of composite solders. ► Tensile properties of the composite solders. ► Strain rate effects in the tensile deformation of the composite solders.