Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1579355 | Materials Science and Engineering: A | 2010 | 4 Pages |
Abstract
The electron back scattering diffraction (EBSD) technique has been applied in investigating the crystallographic mechanism of crack propagation in Al–Zn–Mg–Cu alloy. It is revealed that intergranular and transgranular crack propagation behaviours both exist and the relationship between crack propagation and orientations of adjacent grains complies with the crystal plastic deformation mechanism. When the interfacial angle between fracture surfaces of two adjacent grains is small, the crack propagates through grain boundaries with deflection of a certain angle; while small interfacial angles cannot form between slip planes in two adjacent grains, intergranular propagation occurs.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Haigen Jian, Feng Jiang, Lili Wei, Xiuyuan Zheng, Kang Wen,