Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1579582 | Materials Science and Engineering: A | 2010 | 8 Pages |
Abstract
Cu-Ni-Sn alloys with Pb additions exhibit high mechanical strength at room temperature coupled with good machinability but experience a significant ductility loss above the melting point of lead. We explore here the influence of minor additions of Al, Mn, Zr, B or P to the copper alloy CuNi9Sn6Pb1 on its tensile properties at 400 °C and 10â2 sâ1. Only boron and phosphorous additions have a clear beneficial effect. Unlike other elements tested, these form intermetallic particles; it is proposed that the improvement results from a combination of capillary pinning and mechanical shielding by these particles of the molten lead inclusions in the alloy.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
D. Empl, V. Laporte, E. Vincent, N. Dewobroto, A. Mortensen,