Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1579592 | Materials Science and Engineering: A | 2010 | 7 Pages |
Abstract
The mechanical properties and electrical resistivity of nanocrystalline copper reinforced by 1Â vol.% and 5Â vol.% of nano-alumina particles have been measured. The composites were prepared by ball-milling and consolidated by a combination of hot extrusion and HIPing. The uniaxial tensile and compressive strengths are comparable for each composite, and an elastic, ideally plastic response is observed. Shear bands, of width a few microns, accompany plastic deformation. A number of microstructural characterisation tools were used to reveal that grain boundary strengthening and dispersion strengthening are the dominant strengthening mechanisms. Nano-indentation measurements reveal a size effect in hardness. The electrical resistivity is almost double that of pure oxygen free copper and this is mainly ascribed to the presence of dissolved iron.
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Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
S. Nachum, N.A. Fleck, M.F. Ashby, A. Colella, P. Matteazzi,