Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1579745 | Materials Science and Engineering: A | 2010 | 4 Pages |
Abstract
In situ nano-scale Cu–Cu2O composites have been prepared by addition of K2TiF6 and KBF4 into Cu melt, and the microstructure, resistivity and microhardness of Cu–Cu2O composites have been studied in this work. Cu2O (100–300 nm) in the Cu matrix can be obtained by addition of oxidation agent (K2TiF6 and KBF4), and when the addition level is 3 wt%, hyper-Cu–Cu2O can be obtained with constitutes of copper matrix, reinforcing particles-Cu2O (100–300 nm), and some nano-scale particles. It is found that the resistivity of Cu–Cu2O composites are close to those of pure copper at 20 °C. In addition, the hardness of the composite has been improved significantly as compared to those of pure Cu.
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Authors
Yuying Wu, Xiangfa Liu, Junqing Zhang, Jingyu Qin, Chong Li,