Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1579821 | Materials Science and Engineering: A | 2010 | 8 Pages |
Abstract
Nanocrystalline Ni with mean grain sizes ranging from ∼15 to 95 nm was fabricated by electroplating and post-annealing. The influence of annealing on deformation behavior was systematically investigated by inspecting strain rate sensitivity (m) and activation volume (V) using nanoindentation. In addition to the strong dependence of the m and V values on nanograin sizes, annealing induced grain boundary change, probably caused by GB relaxation and segregation, leads to the transition from a stress-activated dislocation emission mechanism in the as-fabricated sample to a thermal activation on dislocation emission.
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Authors
X.F. Zhang, T. Fujita, D. Pan, J.S. Yu, T. Sakurai, M.W. Chen,